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CRF Instruments

Cleanroom Facilities provide the instruments for fabrication and characterization of semiconductor materials and devices. 

See Our Instrumentation List for a sortable list of all SRF instruments, location, and contact person.

Patterning Deposition Plasma Etching Thermal Processing Sample Inspection/Packaging

Patterning

Mask Aligners

Suss Microtech MA6 Mask Aligner

Purpose: For patterning photosensitive polymers with UV light

Suss Microtech MJB3 Mask Aligner

Purpose: For patterning photosensitive polymers with UV light

Spinners

Laurel Technologies 400 Spinners

Purpose: For applying uniform polymer films like photoresist or for spin cleaning with solvents

Laurel Technologies 600 Spinner

Purpose: For applying uniform polymer films like photoresist or for spin cleaning with solvents

UV Flood Exposure

OAI UV Flood Exposure

Purpose: To provide a uniform beam of UV light for photolithography processing

E-beam Lithography

JEOL JSM-7600F Scanning Electron Microscope (SEM)

Purpose: For structural characterization and lithography of complex patterns at nanometer scale precision

Deposition

E-beam Evaporation

Temescal BJD 2000 E-Beam Evaporator

Purpose: For the deposition of metal and oxide thin films

Sputtering Systems

CVC 610 DC Magnetron Sputtering Station

Purpose: For the deposition of metal thin films

Sputtering Station – White Hall

Purpose: For the deposition of thin films

Pulsed Laser Deposition

Neocera PLD

Purpose: Multipurpose system for the deposition of thin films using PLD, PED, and sputtering techniques

PECVD (Plasma Enhanced Chemical Vapor Deposition)

Oxford Plasmalab 80+ PECVD

Purpose: For the deposition of silicon oxide or silicon nitride films

Plasma Etching & Cleaning

Reactive Ion Etching (RIE) with ICP (Inductively Coupled Plasma)

Trion Technology Minilock III RIE

Purpose: For plasma etching of semiconductors, insulators, metals and polymers

Plasma Asher

March PX-250 Plasma Asher

Purpose: For cleaning substrates with oxygen plasma

Thermal Processing

Rapid Thermal Processing

AnnealSys AS-Micro Rapid Thermal Annealer

Oxidation Furnace

Lindberg Blue M Tube Furnace

Purpose: For silicon oxide and titanium oxide growth

Programmable Furnace

Thermolyne 6000 Programmable Furnace

Purpose: For annealing samples in air or nitrogen atmosphere

Furnace

Lindberg Blue M Tube Furnace

Purpose: For annealing samples less than ½-inch diameter

Sample Inspection/Packaging

Stylus Profilometer

Tencor Alpha-Step 200

Purpose: For non-destructive measuring of height

Optical Microscopy

Olympus BH-2 UMA

Purpose: For visual examination of features

MEIJI MT7000

Purpose: For visual examination of features

Packaging

Gold Wire Bonder – West Bond 74776E

Purpose: For making gold wire connections between device and package

Epoxy Die Bonder – West Bond 7372E

Purpose: For epoxy mounting 10×10 mm die into package

Dicing

DISCOTECH DAD-3240 Dicing Saw

Purpose: High throughput system for the dicing of materials from silicon to ceramics